The Challenge:
Reliability Under Critical Load
In backend packaging, even minor inconsistencies in ceramic components can lead to system failure. For example, robust protection is required for chip structures during dicing, bonding, and encapsulation steps. Customers need reliable materials that maintain performance under thermal and mechanical stress while ensuring clean interfaces.
How We Help:
Alumina Engineered for Insulation and Stability
Our alumina supports ceramic substrates, insulators, and thermal interface materials in chip-scale packaging. We offer 4N and 5N options with tight PSD control, so your parts stay stable and defect-free, run after run.
Related Products
Get the format that supports your process
Ultra-high-purity alumina for molded or formed packaging components requiring high insulation and purity.
Ultra-high-purity alumina for molded or formed packaging components requiring high insulation and purity.
Pure Precision. Proven Performance.
Every part matters in backend packaging. We help you meet specs with high-purity alumina that’s designed for repeatability and reliability.
High Thermal Robustness
Maintains integrity under heat and stress
Electrical Insulation
Supports clean signal paths and reduces leakage risk
Trusted Documentation
Full traceability for qualification and audits
The Processes We Protect
We support packaging workflows that demand precision and cleanliness.
Traceable By Design
Our quality system maintains traceability across all batches. Whether you need to confirm PSD ranges or provide documentation for a second source, we make it easy to retrieve the records you need.
Frequently asked questions
A: Yes. Our alumina is used in ceramic substrates and thermal interface layers for chip-scale and advanced packaging formats.
A: High purity reduces the risk of leakage current, breakdowns, and thermal inconsistency. Our alumina minimizes impurities that could impact yield.
A: We offer 4N and 5N grades with tight particle control, customizable to customer needs.
A: Absolutely. We support custom sizing and offer full documentation to support validation against existing materials.